Workshop on Flexible Electronics


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Workshop on Flexible Electronics

date time session room

Wed., Nov. 27 17:00-17:05 Opening Room 108

17:05-18:30 FLX1/FMC3 Advanced Materials and Components for Flexible Electronics

Thu., Nov. 28 14:30-17:00 FLXp1 Flexible Electronics Technologies Main Hall

17:20-18:30 FLX2 Stretchable and Flexible Devices Mid-sized Hall B

Fri., Nov. 29 9:00-10:15 FLX3 Printed TFT Technologies Room 107

10:40-12:15 FLX4 Wearable Sensors and Devices

13:20-14:50 LCT7/FLX5 Flexible LCDs Room 204

15:00-16:00 FLX6 Advanced Process and Evaluation for Flexible Electronics

FLX1/FMC3 : Advanced Materials and Components for Flexible Electronics

Wed., Nov. 27  17:05-18:30  Room 108

Chair: Toshihide Kamata (National Institute of Advanced Industrial Science and Technology)
Co-Chair: Makoto Arai (ULVAC Inc.)

FLX1/FMC3-1 Invited Printed Invisible Silver-Grid Transparent Electrode on Flexible Epoxy Film and Application to Powder Electroluminescent Device
*Masato Ohsawa¹, Natsuki Hashimoto¹, Naoki Takeda², Shota Tsuneyasu², Toshifumi Satoh² (1. ULVAC, Inc. (Japan), 2. Tokyo Polytechnic University (Japan))

FLX1/FMC3-2 Al Alloying Effect in Functionalization of Mechanical Resistance to Foldable Display Interconnections
*Chiharu Kura¹, Mototaka Ochi¹, Hiroyuki Okuno², Hiroshi Goto² (1. Kobe Steel, LTD. (Japan), 2. Kobelco Research Institute, Inc. (Japan))

FLX1/FMC3-3 Withdrawn

FLX1/FMC3-4 Improvement of the Corrosion Resistance of TCO/Ag/TCO Structure for Transparent Conductive Layer
*Yuto Toshimori¹, Sohei Nonaka¹ (1. Mitsubishi Materials Corporation (Japan))

FLX1/FMC3-5L Roll-to-Roll Processing of Transparent and Robust Permeation Barrier Films for Flexible Electronics
*John Fahlteich¹, Michiel Top¹, Stefan Hinze¹, Uwe Meyer¹, Tobias Vogt¹, Valentijn von Morgen², Matthias Fahland¹ (1. Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Germany), 2. DuPont Teijin Films Ltd. (UK))

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FLX2 : Stretchable and Flexible Devices

Thu., Nov. 28  17:20-18:30  Mid-sized Hall B

Chair: Manabu Ito (Toppan Printing Co.)
Co-Chair: Mitsuru Nakata (NHK)

FLX2-1 Invited Development of Flexible /Stretchable Epoxy Film with High Thermal Stability, Especially Suitable for Versatile Printed Electronics Applications
*Noriyasu Yamane¹, Kenta Yamamoto¹, Kotaro Nozawa¹, Takashi Komori¹, Tomohide Murase¹, Takayoshi Hirai¹ (1. Mitsubishi Chemical Corporation (Japan))

FLX2-2 Invited High Performance IGTO Transistors with Stretchable Gate Dielectric Layer
*Jae Kyeong Jeong¹, Jae Seok Hur Hur¹, Jeong Oh Kim¹ (1. Hanyang University (Korea))

FLX2-3 Study on Top-Gate Self-Aligned InGaZnO TFTs on PI Substrate
*Nian Liu¹, Huafei Xie², Macai Lu¹, Xueru Mei¹, Lei Wen¹, Shujhih Chen¹, Shengdong Zhang², Chiayu Lee¹, Xin Zhang¹ (1. Shenzhen China Star Optoelectronics Semiconductor Display Technology Co.Ltd., China (China), 2. School of Electronic and Computer Engineering, Peking University, Shenzhen, China (China))

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FLX3 : Printed TFT Technologies

Fri., Nov. 29  9:00-10:15  Room 107

Chair: Hiroki Meada (Dai Nippon Printing Co., Ltd.)
Co-Chair: Takashi Nagase (Osaka Prefecture University)

FLX3-1 Invited Printed Thin Film Transistors Using Semi-Conductive Single Wall Carbon Nanotube-Polymer Complexes
*Seiichiro Murase¹, Kazuki Isogai¹, Takayoshi Hirai¹, Yasuhiro Kobayashi¹, Kenta Noguchi¹, Hiroji Shimizu¹ (1. Toray Industries, Inc. (Japan))

FLX3-2 Invited Towards Ideal Printed Organic Transistors
Fuhua Dai¹, *Chuan Liu¹ (1. Sun Yat-sen University (China))

FLX3-3 Invited Development of High Performance Semiconductor Inks for Printed Field-Effect Transistors For Flexible Display
Huihui Zhu¹, Ao Liu¹, Dongseob Ji¹, *YONG-YOUNG NOH¹ (1. Pohang University of Science and Technology (POSTECH) (Korea))

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FLX4 : Wearable Sensors and Devices

Fri., Nov. 29  10:40-12:15  Room 107

Chair: Yasuyoshi Mishima (National Institute of Advanced Industrial Science and Technology)
Co-Chair: Hiroyuki Endoh (NEC Corp.)

FLX4-1 Invited Ultra-Flexible Organic Imager and Sensors
*Tomyouki Yokota¹, Takao Someya¹ (1. The University of Tokyo (Japan))

FLX4-2 Invited Organic TFT-Based Biosensors Functionalized with Artificial Receptors
*Tsuyoshi Minami¹ (1. Institute of Industrial Science, The University of Tokyo (Japan))

FLX4-3 Invited Ultra-Conformable Biodevice for Advanced Medicine and Healthcare
*Toshinori Fujie¹ (1. Tokyo Institute of Technology (Japan))

FLX4-4 Polysilicon CMOS TFTs on Ultrathin and Flexible Stainless Steel Substrates
*Miki Trifunovic¹, Aditi Chandra¹, Mao Ito¹, Sarah Khoo¹, Arvind Kamath¹ (1. Thin Film Electronics Inc. (United States of America))

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LCT7/FLX5 : Flexible LCDs

Fri., Nov. 29  13:20-14:50  Room 204

Chair: Shinichiro Oka (Japan Display Inc.)
Co-Chair: Toshimasa Eguchi (Sumitomo Bakelite Co., Ltd.)

LCT7/FLX5-1 Invited Flexible LCD with Colorless Polyimide
*Kaijun Wang¹, Chunge Yuan¹, Zhuhui Li¹, Li Zhang¹, Qiao Huang¹, Linshuang Li¹, Shujhih Chen¹, Chia-Yu Lee¹, Xin Zhang² (1. Shenzhen China Star Optoelectronics Semiconductor Display Technology Co.Ltd. (China), 2. Shenzhen China Star Optoelectronics Technology Co., Ltd. (China))

LCT7/FLX5-2 Invited Ultra-High Contrast OLCD: Thin and light Dual Cell LCDs on plastic
*Paul A Cain¹, James Harding¹, William Reeves¹, May Wheeler¹ (1. FlexEnable Ltd (UK))

LCT7/FLX5-3 Formation of Polymer Walls with a High Aspect Ratio on a Plastic Substrate
*Su Min Do¹, Tae Hoon Choi¹, Jae Won Huh¹, Yeongyu Choi¹, Tae Hoon Yoon¹ (1. Pusan National University (Korea))

LCT7/FLX5-4L New Approach to Process Simplification for Flexible TFT-LCD
*Cheng-He Ruan¹, Chih-Yuan Hou¹, Chia-Jen Li¹, Shih-Min Chen¹, Min-Zi Hong¹ (1. AU Optronics Corporation (Taiwan))

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FLX6 : Advanced Process and Evaluation for Flexible Electronics

Fri., Nov. 29  15:00-16:00  Room 204

Chair: Tadahiro Furukawa (Yamagata University)
Co-Chair: Akira Nakazawa (AGC Inc.)

FLX6-1 Invited Solution-Processing of Inorganic and Hybrid Materials for High Performance Flexible Electronics
*Myung-Gil Kim¹ (1. Sungkyunkwan University (Korea))

FLX6-2 Analysis and Design of Mechanical Stresses on Foldable Devices
*Nao Ando¹, Kei Hyodo¹, Hisao Sasaki¹, Yoshihito Ota¹, Tomoki Sasayama², Yoshihiko Iwao², Tomoya Tsuda², Nao Terasaki³ (1. YUASA SYSTEM (Japan), 2. Shimadzu Co. (Japan), 3. AIST (Japan))

FLX6-3 Withdrawn

FLX6-4L To Make a Flexible Patch Type Photoelectric Pulse Wave Sensor Highly Sensitivity
*Mana Hashimoto¹, Kazuki Ihara¹, Hiroshi Kajitani¹, Hiroyuki Endo¹ (1. NEC Corporation. (Japan))

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Poster FLXp1 : Flexible Electronics Technologies

Thu., Nov. 28  14:30-17:00  Main Hall

FLXp1-1 Electromagnetic Interference Shielding Using ITO Nano-Branch and Metal Nano-Particle Decoration
*Youngho Kim¹, Hak Ki Yu¹ (1. Ajou University (Korea))

FLXp1-2 Withdrawn

FLXp1-3 Withdrawn

FLXp1-4 Effect of Contaminant Particles on Folding of Encapsulating Organic-Inorganic Multilayer for Foldable OLEDs
*Yun taek Park¹, Sang woo Kim¹, Gui young Han¹, Sung min Cho¹ (1. University of Sungkyunkwan (Korea))

FLXp1-5 Withdrawn

FLXp1-6 Effect of OCA Properties on Foldable AMOLED Panel with a Module Structure
*Yali Liu¹, Yongzhen Jia², Zhengzhou Liu³, Di Wu³, Haoqun Li¹, Zhuo Zhang¹ (1. WuHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO.,LTD (China), 2. Shenzhen China Star Optoelectronics Technology Co., Ltd, Shenzhen, 518132, China (China), 3. State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, 430074, China (China))

FLXp1-7 Room-Temperature Solution-Synthesized p-type Copper(I) Iodide Semiconductors for Transparent Thin Film Transistors and Complementary Electronics
*Ao Liu¹, Huihui Zhu¹, Yong-Young Noh¹ (1. Pohang University of Science and Technology (POSTECH) (Korea))

FLXp1-8 A High Performance 3-bit Ripple Counter Circuit Based on Organic TFTs for Flexible Read Out Integrated Circuit
*Hansai Ji¹, Di Geng¹, Yuxin Gong¹, Qian Chen¹, Xinlv Duan¹, Yue Su¹, Xuewen Shi¹, Linrun Feng², Zhe Liu², Minghua Tang³, Simon Ogier⁴, Ling Li¹, Ming Liu¹ (1. Institute of microelectronics of the academy of science (China), 2. Wuhan LinkZill Technology Co., Ltd. (China), 3. Xiangtan University (China), 4. NeuDrive Limited (China))

FLXp1-9L Scribing Tool and Cutting Method for Ultra-thin Glass
*Tomoki Nakagaki¹, Takashi Kawabata¹, Hiroshi Takimoto², Tadahiro Furukawa³ (1. Mitsuboshi Diamond Industrial Co., Ltd. (Japan), 2. Nippon Electric Glass Co., Ltd. (Japan), 3. Yamagata University (Japan))

FLXp1-10L Semiconducting Carbon Nanotube-Based Stretchable Transistors
*Dongseob Ji¹, Jimin Kwon¹, Haksoon Jung¹, Yong-Young Noh¹ (1. Pohang University of Science and Technology (Korea))

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date	time	session		room
Wed., Nov. 27	17:00-17:05		Opening	Room 108
Wed., Nov. 27	17:05-18:30	FLX1/FMC3	Advanced Materials and Components for Flexible Electronics	Room 108
Thu., Nov. 28	14:30-17:00	FLXp1	Flexible Electronics Technologies	Main Hall
Thu., Nov. 28	17:20-18:30	FLX2	Stretchable and Flexible Devices	Mid-sized Hall B
Fri., Nov. 29	9:00-10:15	FLX3	Printed TFT Technologies	Room 107
	10:40-12:15	FLX4	Wearable Sensors and Devices	Room 107
	13:20-14:50	LCT7/FLX5	Flexible LCDs	Room 204
	15:00-16:00	FLX6	Advanced Process and Evaluation for Flexible Electronics	Room 204

FLX1/FMC3-1	Invited Printed Invisible Silver-Grid Transparent Electrode on Flexible Epoxy Film and Application to Powder Electroluminescent Device *Masato Ohsawa¹, Natsuki Hashimoto¹, Naoki Takeda², Shota Tsuneyasu², Toshifumi Satoh² (1. ULVAC, Inc. (Japan), 2. Tokyo Polytechnic University (Japan))
FLX1/FMC3-2	Al Alloying Effect in Functionalization of Mechanical Resistance to Foldable Display Interconnections *Chiharu Kura¹, Mototaka Ochi¹, Hiroyuki Okuno², Hiroshi Goto² (1. Kobe Steel, LTD. (Japan), 2. Kobelco Research Institute, Inc. (Japan))
FLX1/FMC3-3	Withdrawn
FLX1/FMC3-4	Improvement of the Corrosion Resistance of TCO/Ag/TCO Structure for Transparent Conductive Layer *Yuto Toshimori¹, Sohei Nonaka¹ (1. Mitsubishi Materials Corporation (Japan))
FLX1/FMC3-5L	Roll-to-Roll Processing of Transparent and Robust Permeation Barrier Films for Flexible Electronics *John Fahlteich¹, Michiel Top¹, Stefan Hinze¹, Uwe Meyer¹, Tobias Vogt¹, Valentijn von Morgen², Matthias Fahland¹ (1. Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Germany), 2. DuPont Teijin Films Ltd. (UK))

FLX2-1	Invited Development of Flexible /Stretchable Epoxy Film with High Thermal Stability, Especially Suitable for Versatile Printed Electronics Applications *Noriyasu Yamane¹, Kenta Yamamoto¹, Kotaro Nozawa¹, Takashi Komori¹, Tomohide Murase¹, Takayoshi Hirai¹ (1. Mitsubishi Chemical Corporation (Japan))
FLX2-2	Invited High Performance IGTO Transistors with Stretchable Gate Dielectric Layer *Jae Kyeong Jeong¹, Jae Seok Hur Hur¹, Jeong Oh Kim¹ (1. Hanyang University (Korea))
FLX2-3	Study on Top-Gate Self-Aligned InGaZnO TFTs on PI Substrate *Nian Liu¹, Huafei Xie², Macai Lu¹, Xueru Mei¹, Lei Wen¹, Shujhih Chen¹, Shengdong Zhang², Chiayu Lee¹, Xin Zhang¹ (1. Shenzhen China Star Optoelectronics Semiconductor Display Technology Co.Ltd., China (China), 2. School of Electronic and Computer Engineering, Peking University, Shenzhen, China (China))

FLX3-1	Invited Printed Thin Film Transistors Using Semi-Conductive Single Wall Carbon Nanotube-Polymer Complexes *Seiichiro Murase¹, Kazuki Isogai¹, Takayoshi Hirai¹, Yasuhiro Kobayashi¹, Kenta Noguchi¹, Hiroji Shimizu¹ (1. Toray Industries, Inc. (Japan))
FLX3-2	Invited Towards Ideal Printed Organic Transistors Fuhua Dai¹, *Chuan Liu¹ (1. Sun Yat-sen University (China))
FLX3-3	Invited Development of High Performance Semiconductor Inks for Printed Field-Effect Transistors For Flexible Display Huihui Zhu¹, Ao Liu¹, Dongseob Ji¹, *YONG-YOUNG NOH¹ (1. Pohang University of Science and Technology (POSTECH) (Korea))

FLX4-1	Invited Ultra-Flexible Organic Imager and Sensors *Tomyouki Yokota¹, Takao Someya¹ (1. The University of Tokyo (Japan))
FLX4-2	Invited Organic TFT-Based Biosensors Functionalized with Artificial Receptors *Tsuyoshi Minami¹ (1. Institute of Industrial Science, The University of Tokyo (Japan))
FLX4-3	Invited Ultra-Conformable Biodevice for Advanced Medicine and Healthcare *Toshinori Fujie¹ (1. Tokyo Institute of Technology (Japan))
FLX4-4	Polysilicon CMOS TFTs on Ultrathin and Flexible Stainless Steel Substrates *Miki Trifunovic¹, Aditi Chandra¹, Mao Ito¹, Sarah Khoo¹, Arvind Kamath¹ (1. Thin Film Electronics Inc. (United States of America))

LCT7/FLX5-1	Invited Flexible LCD with Colorless Polyimide *Kaijun Wang¹, Chunge Yuan¹, Zhuhui Li¹, Li Zhang¹, Qiao Huang¹, Linshuang Li¹, Shujhih Chen¹, Chia-Yu Lee¹, Xin Zhang² (1. Shenzhen China Star Optoelectronics Semiconductor Display Technology Co.Ltd. (China), 2. Shenzhen China Star Optoelectronics Technology Co., Ltd. (China))
LCT7/FLX5-2	Invited Ultra-High Contrast OLCD: Thin and light Dual Cell LCDs on plastic *Paul A Cain¹, James Harding¹, William Reeves¹, May Wheeler¹ (1. FlexEnable Ltd (UK))
LCT7/FLX5-3	Formation of Polymer Walls with a High Aspect Ratio on a Plastic Substrate *Su Min Do¹, Tae Hoon Choi¹, Jae Won Huh¹, Yeongyu Choi¹, Tae Hoon Yoon¹ (1. Pusan National University (Korea))
LCT7/FLX5-4L	New Approach to Process Simplification for Flexible TFT-LCD *Cheng-He Ruan¹, Chih-Yuan Hou¹, Chia-Jen Li¹, Shih-Min Chen¹, Min-Zi Hong¹ (1. AU Optronics Corporation (Taiwan))

FLX6-1	Invited Solution-Processing of Inorganic and Hybrid Materials for High Performance Flexible Electronics *Myung-Gil Kim¹ (1. Sungkyunkwan University (Korea))
FLX6-2	Analysis and Design of Mechanical Stresses on Foldable Devices *Nao Ando¹, Kei Hyodo¹, Hisao Sasaki¹, Yoshihito Ota¹, Tomoki Sasayama², Yoshihiko Iwao², Tomoya Tsuda², Nao Terasaki³ (1. YUASA SYSTEM (Japan), 2. Shimadzu Co. (Japan), 3. AIST (Japan))
FLX6-3	Withdrawn
FLX6-4L	To Make a Flexible Patch Type Photoelectric Pulse Wave Sensor Highly Sensitivity *Mana Hashimoto¹, Kazuki Ihara¹, Hiroshi Kajitani¹, Hiroyuki Endo¹ (1. NEC Corporation. (Japan))

FLXp1-1	Electromagnetic Interference Shielding Using ITO Nano-Branch and Metal Nano-Particle Decoration *Youngho Kim¹, Hak Ki Yu¹ (1. Ajou University (Korea))
FLXp1-2	Withdrawn
FLXp1-3	Withdrawn
FLXp1-4	Effect of Contaminant Particles on Folding of Encapsulating Organic-Inorganic Multilayer for Foldable OLEDs *Yun taek Park¹, Sang woo Kim¹, Gui young Han¹, Sung min Cho¹ (1. University of Sungkyunkwan (Korea))
FLXp1-5	Withdrawn
FLXp1-6	Effect of OCA Properties on Foldable AMOLED Panel with a Module Structure *Yali Liu¹, Yongzhen Jia², Zhengzhou Liu³, Di Wu³, Haoqun Li¹, Zhuo Zhang¹ (1. WuHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO.,LTD (China), 2. Shenzhen China Star Optoelectronics Technology Co., Ltd, Shenzhen, 518132, China (China), 3. State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, 430074, China (China))
FLXp1-7	Room-Temperature Solution-Synthesized p-type Copper(I) Iodide Semiconductors for Transparent Thin Film Transistors and Complementary Electronics *Ao Liu¹, Huihui Zhu¹, Yong-Young Noh¹ (1. Pohang University of Science and Technology (POSTECH) (Korea))
FLXp1-8	A High Performance 3-bit Ripple Counter Circuit Based on Organic TFTs for Flexible Read Out Integrated Circuit *Hansai Ji¹, Di Geng¹, Yuxin Gong¹, Qian Chen¹, Xinlv Duan¹, Yue Su¹, Xuewen Shi¹, Linrun Feng², Zhe Liu², Minghua Tang³, Simon Ogier⁴, Ling Li¹, Ming Liu¹ (1. Institute of microelectronics of the academy of science (China), 2. Wuhan LinkZill Technology Co., Ltd. (China), 3. Xiangtan University (China), 4. NeuDrive Limited (China))
FLXp1-9L	Scribing Tool and Cutting Method for Ultra-thin Glass *Tomoki Nakagaki¹, Takashi Kawabata¹, Hiroshi Takimoto², Tadahiro Furukawa³ (1. Mitsuboshi Diamond Industrial Co., Ltd. (Japan), 2. Nippon Electric Glass Co., Ltd. (Japan), 3. Yamagata University (Japan))
FLXp1-10L	Semiconducting Carbon Nanotube-Based Stretchable Transistors *Dongseob Ji¹, Jimin Kwon¹, Haksoon Jung¹, Yong-Young Noh¹ (1. Pohang University of Science and Technology (Korea))